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ADVANCE INFORMATION
PACKAGE OUTLINE
ZXMP3A17E6
PAD LAYOUT DETAILS
b
e
L 2
E
E1
e1
a
DATUM A
D
C
A
A2
A1
CONTROLLING DIMENSIONS IN MILLIMETRES APPROX CONVERSIONS INCHES.
PACKAGE DIMENSIONS
DIM
Millimetres
Inches
DIM
Millimetres
Inches
Min
Max
Min
Max
Min
Max
Min
Max
A
A1
A2
0.90
0.00
0.90
1.45
0.15
1.30
0.35
0
0.035
0.057
0.006
0.051
E
E1
L
2.60
1.50
0.10
3.00
1.75
0.60
0.102
0.059
0.004
0.118
0.069
0.002
b
C
0.35
0.09
0.50
0.20
0.014
0.0035
0.019
0.008
e
e1
0.95 REF
1.90 REF
0.037 REF
0.074 REF
D
2.80
3.00
0.110
0.118
L
0°
10°
0°
10°
? Zetex plc 2003
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Zetex plc
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Telephone (44) 161 622 4444
Fax: (44) 161 622 4446
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Telefon: (49) 89 45 49 49 0
Fax: (49) 89 45 49 49 49
europe.sales@zetex.com
Zetex Inc
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USA
Telephone: (1) 631 360 2222
Fax: (1) 631 360 8222
usa.sales@zetex.com
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Kwai Fong
Hong Kong
Telephone: (852) 26100 611
Fax: (852) 24250 494
asia.sales@zetex.com
These offices are supported by agents and distributors in major countries world-wide.
This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced
for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company
reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
For the latest product information, log on to
ISSUE 2 - JUNE 2003
www.zetex.com
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SEMICONDUCTORS
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